House of technology seminar ‘encapsulation technique in the electrical engineering and Electronics’ components and assemblies in electronics and cable connections in the energy technology are always more frequently formgebend overmolded (poured over) and protected as safe against environmental influences. Encapsulation technique is applying or wrapping a liquid, 1 – or 2-component sealing compound on a defined PCB, case, until all components are cast. If the compound is dried and cured, all components are encapsulated. This protects the electric circuit or the cable connection against moisture, dust, pollution, vibration, and shock. It improves the electrical insulation, flame retardancy, the cohesion of the circuit during transport or installation in the field. The encapsulation technique nowadays increasingly gaining importance, as the warranty obligations of the manufacturer.
The trend contributes a large part to the compact construction, especially in the automotive industry. Here move E.g. electrics and electronics is closer to the engine room, what greater demands on the shield. Applications for the encapsulation technique can be found in every industry, from automotive via Industrieelektronikapplikationen to energy technology. The procedure for selecting the correct the potting compound for the different applications is the focus of a one-day event “encapsulation technique for electrical engineering and Electronics”, offered by the Haus der Technik on March 3, 2010 in Essen. Typical ver casting defects, their cause and prevention are discussed in detail. Machines for the application of the products are presented in detail. There are the ideal potting compound nor the ideal potting machine.
Only the ideal combination of customer, quantity of production, sealing compound, as well as mixing and dispensing equipment.